Put silver paste on the pad of the lead frame.ДЎ75в„ѓ, 1 hour N2 environment, prevent oxidation. Paste the wafer on the mylar so that it will not fall apart even after being cut cut the entire wafer into individual dices through the saw blade, which is convenient for the subsequent die attach process clean the wafer and clean the dust produced. After grinding, remove the tape and measure the thickness. When grinding the wafer, it is necessary to stick tape on the front to protect the circuit area and grind the back at the same time. The wafer from the fab will be back-grinded to reduce the waferвЂ™s thicknessВ to the package thickness (8mils~10mils). Incoming quality inspection of wafers, lead frames, silver paste, bonding wires, molding materials, etc. The properties, performance,В and limitations of these componentsВ check the temperature, voltage, frequency,В and other parameter characteristics of these components or equipment.

The purpose is to analyze data on mobile phone components and to understand this component and process. It is used to generate specifications and datasheets for products, processes,В or packaging.

AEC-Q003 is a characteristic guideline proposed for the typical performance of chip tea farmers. It is widely usedВ to make early detectionВ in the wafer and bare die stages. It provides component manufacturers with statistical techniques to detect and remove abnormal chip components. AEC-Q002 is based on statistical principles, and it is a statistical yield analysis. AEC-Q001 mainly proposes the Parametric Part Average Testing (PPAT) method, a statistical method used to detect abnormal characteristics of outer semiconductor componentsВ and remove abnormal components from all products. AEC-Q001/Q002/Q003 standards are mainly guiding principles.

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